ASML has maintained a near-monopoly on the production of advanced lithography systems, which are essential for making high-performance semiconductors. Recently, the company introduced high-numerical-aperture (high-NA) EUV technology to further improve chip production.

ASML 在製造高性能半導體至關重要的先進微影系統生產方面，一直維持著近乎壟斷的地位。最近，該公司推出了高數值孔徑 (high-NA) EUV 技術，以進一步提升晶片生產能力。

The semiconductor industry relies on making transistors smaller to increase computing power. ASML has supported this trend by developing extreme-ultraviolet (EUV) lithography. This process uses lasers to create short-wavelength radiation, allowing circuits to be printed at a resolution as small as eight nanometers. Currently, the market is dominated by ASML, which provides the hardware, and TSMC, which uses that hardware for mass production. This concentration of power has caused significant geopolitical tension, leading to a 2019 US-led ban on exporting high-end EUV systems to China.

半導體產業依賴於將電晶體縮小以增加運算能力。ASML 透過開發極紫外光 (EUV) 微影技術來支持這一趨勢。這個過程利用雷射產生短波長輻射，使電路能以低至 8 奈米的解析度進行印刷。目前，市場由提供硬體的 ASML 以及使用該硬體進行量產的台積電 (TSMC) 主導。這種權力集中導致了嚴重的地緣政治緊張，導致美國在 2019 年領導禁止向中國出口高端 EUV 系統。

In response, China has invested in state-funded projects to develop its own technology. Although China has built large prototypes, analysts emphasize that these may not be efficient enough for industrial use. Consequently, China is optimizing older deep-ultraviolet (DUV) systems through software and new patterning methods. Meanwhile, ASML has moved toward 'high-NA' EUV systems. This upgrade increases the numerical aperture from 0.33 to 0.55, requiring larger, more precise mirrors from Zeiss. Intel has been the first to adopt this technology in an effort to compete more effectively with TSMC.

為了回應，中國投資了國家資助的計畫來開發自有技術。雖然中國建構了大型原型機，但分析師強調這些設備對於工業用途而言可能不夠高效。因此，中國正透過軟體和新的圖案化方法來優化較舊的深紫外光 (DUV) 系統。與此同時，ASML 已向 "high-NA" EUV 系統邁進。此次升級將數值孔徑從 0.33 提升至 0.55，需要蔡司 (Zeiss) 提供更大、更精確的鏡片。Intel 是首家採用此技術的公司，旨在更有效地與台積電競爭。

Despite ASML's current dominance, some new competitors are trying non-traditional methods to avoid the high costs of EUV. For example, Substrate is exploring x-ray lithography, while Lace Lithography is using energized helium atoms. These startups aim to reduce the massive expenses associated with modern chip factories. However, industry experts remain skeptical about whether these new methods can produce the high volume of chips required for global commercial competition.

儘管 ASML 目前佔據主導地位，但一些新競爭對手正嘗試以非傳統方法來避開 EUV 的高成本。例如，Substrate 正在探索 X 射線微影，而 Lace Lithography 則使用激發氦原子。這些新創公司旨在降低現代晶片廠的巨額開支。然而，業界專家對於這些新方法是否能生產出全球商業競爭所需的大量晶片仍持懷疑態度。

ASML continues to hold a dominant position in the semiconductor supply chain, and its future growth depends on the successful rollout of high-NA and potential 'hyper-NA' systems.

ASML 繼續在半導體供應鏈中佔據主導地位，其未來增長取決於 high-NA 以及潛在 "hyper-NA" 系統的成功推出。