Huawei Technologies has unveiled a new chip design methodology intended to achieve high-end semiconductor performance by 2031, bypassing the need for restricted Western lithography equipment.

華為技術揭曉了一套新的晶片設計方法，旨在 2031 年前實現高端半導體性能，以避開對受限西方光刻設備的需求。

The strategic pivot is centered on a proprietary architectural approach termed 'LogicFolding' and a theoretical framework designated as the 'Tau Scaling Law.' This methodology represents a departure from the traditional Moore's Law paradigm, which prioritizes the reduction of transistor size. Instead, Huawei proposes a vertical integration strategy, stacking two-dimensional circuits into three-dimensional structures to enhance transistor density and data transmission efficiency. The company asserts that this approach will enable the production of chips with a transistor density equivalent to 1.4-nanometer processes by 2031, despite the absence of extreme ultraviolet (EUV) lithography machines.

此次策略轉型核心在於一套稱為「LogicFolding」的專利架構方法以及一個被命名為「Tau Scaling Law」的理論框架。此方法代表了對傳統摩爾定律範式的突破，不再優先考慮縮小電晶體尺寸。相反地，華為提出了一種垂直整合策略，將二維電路堆疊成三維結構，以提升電晶體密度與數據傳輸效率。該公司聲稱，儘管缺乏極極紫外光（EUV）光刻機，此方法仍將使 2031 年生產的晶片達到等同於 1.4 奈米製程的電晶體密度。

This technological trajectory is situated within a broader context of geopolitical friction and institutional constraints. Since 2019, U.S. sanctions have restricted Huawei's access to global semiconductor fabrication and design software, precipitating a state-led initiative in China to establish an autonomous supply chain. The efficacy of these restrictions has been questioned following the 2023 release of the Mate 60 series, which featured advanced domestically produced 5G chips. Consequently, Nvidia CEO Jensen Huang has indicated that his firm has largely conceded the Chinese market to Huawei, although he maintains that China remains a significant source of long-term demand for specific CPU architectures.

這一技術軌跡處於地緣政治摩擦與制度限制的更廣泛背景之中。自 2019 年以來，美國制裁限制了華為獲取全球半導體製造與設計軟體，促使中國啟動由國家主導的計畫以建立自主供應鏈。隨著 2023 年搭載先進國產 5G 晶片的 Mate 60 系列發布，這些限制的成效受到了質疑。因此，Nvidia 執行長黃仁勳指出，其公司已在很大程度上將中國市場讓給了華為，儘管他維持中國在特定 CPU 架構方面仍是重要的長期需求來源。

Despite the company's claims of having mass-produced 381 chips under this new framework, external analysts maintain a posture of skepticism. Industry experts highlight significant engineering hurdles, specifically regarding thermal management, power consumption, and manufacturing yields associated with vertical stacking. While the implementation of LogicFolding in the upcoming Mate 90 series would constitute a notable engineering achievement, analysts suggest that the scalability of this architecture for AI data centers remains the definitive metric for its viability. Concurrently, Chinese state media and diplomatic channels have advocated for a rapprochement in AI governance, suggesting that competition between the U.S. and China should be non-zero-sum.

儘管該公司聲稱已在這一新框架下量產 381 顆晶片，但外部分析師仍保持懷疑態度。業界專家強調，垂直堆疊在工程上面臨重大挑戰，特別是熱管理、功耗以及製造良率。雖然在即將推出的 Mate 90 系列中實現 LogicFolding 將構成顯著的工程成就，但分析師認為，此架構在 AI 數據中心的擴展能力才是決定其可行性的決定性指標。與此同時，中國官方媒體與外交渠道則倡導 AI 治理的緩和，建議中美之間的競爭不應是零和博弈。

Huawei is attempting to redefine semiconductor scaling to achieve technological self-sufficiency, though the practical scalability of its 3D architecture remains unverified.

華為正嘗試重新定義半導體擴展以實現技術自給自足，但其 3D 架構的實際擴展能力仍未獲驗證。